On 14 May 2026, a group of students from Xiamen University Malaysia (XMUM), accompanied by Dr. Norhayati binti Mohd Zainee, participated in the Institute of Electrical and Electronics Engineers (IEEE) Semiconductor Packaging Bootcamp held at Universiti Putra Malaysia (UPM). The half-day academic visit was organized in collaboration with the IEEE XMUM Student Branch, IEEE Electronics Packaging Society (EPS), IEEE Circuits and Systems Society (CAS), and NXP Semiconductors Malaysia.

Participants attending the IEEE Semiconductor Packaging Bootcamp at UPM

The bootcamp featured a technical sharing session titled "Conventional Semiconductor Packaging Assembly Technology", delivered by Ms. Hiew Pey Fang, a Packaging Assembly Expert from NXP Semiconductors Malaysia. Throughout the session, participants were introduced to the history and evolution of integrated circuits, gaining a broader understanding of how semiconductor technology has developed over time. Students also learned about the semiconductor manufacturing and packaging flow implemented at NXP, including key assembly processes, packaging technologies, and real-world industrial practices used in silicon manufacturing.

The program provided valuable industry exposure by bridging theoretical classroom learning with practical semiconductor manufacturing applications. Participants were able to gain deeper insight into current industry challenges, manufacturing standards, and career opportunities within the semiconductor sector. The knowledge-sharing and Q&A session further encouraged active engagement between students and the industry speaker, allowing participants to clarify technical concepts and explore future career pathways in the electronics and semiconductor industry. 

Group Photo with Speaker from NXP Malaysia